I wonder if its not due to the rubbish we call solder these days. Back in the old days, they designed these things to be held in by the solder, because of the wetting, you would get a good 2-3mm of solder fillet above the PCB, and the lands were much bigger dia, so there was a lot of metal holding the socket/component in place. Now a days the joint does not wet the component leg very well, you are luck if the the PCB hole is filled at all, the top land is very small so all the force is taken by the plated thro hole, which its not designed to do, so it rips out soon, and you get the Dell effect, eg a broken track in a buried layer so the battery won't charge and the laptop is effectively scrap. I think all PCB's should be designed so that all power connections shouuld be done on the top layer, with a large surface contact area, and no ground planes within 2.54cm !. Mind you things would last a lot longer, which would upset the clowns in control who like us to spend our money buying useless chinese crap. I just got a BGA soldering machine, type T862++, and the control system is as you would expect from China, totally useless. It looks pretty but..............
Anyone good at reprogramming Atmels?
Ken