From what I have learnt lead-free solder dries out and cracks at sustained high temperatures just below its melting point.
Nah, nothing of the sort, lead free solder has actualy been in use in some applications for years. t is no worse than leaded solder in fact the only major difference is that it requires around an extra 10-15degC on the re-flow cycle to get the solder to fully wet.
The biggest problem these units have is poor design, compromised PCB lands, poor mechancial support etc. The solder is not to blame (having been very invovled in Rohs6 investigations), there may even be some process issues, again due to poor design....or even PCB contruction/design.
PS3's have been around for a little over 2 years. In that time bigger games have been written such as CODMW2 that stretch the capabilities of the processors making them run very hot - a bit like overclocking a computer - given the age and use of the machines this is leading to a growing number of consoles failing with ylod.
Processors dont increase in temperature the more you do with them in these applications, the internal clock speed is fixed and does not vary and the external bus speeds are the same. Modern RAM requires constant re-fresh cycles even if you do nothing so the micros run at pretty much top temperature no matter what the application during use.
In fact, due to the process size used, the archiecture and clock speeds used, many of these devices operate at 90% of the max power doing nothing but processing idles or wait states (I problem we find in the comms industry with nework processors!)
The only thing that I can think is that this particular game is being played for extended periods with the consoles in compromised installs which restricts the airflow.....so maybe a full saleable solution is to look at improving the cooling and ventilation (not easy without good baselined sim packages such as flowtherm)
Its certainly not related to the specifics of the games processing requirements though.